Microstructure of reaction layer and its effect on the joining strength of SiC/SiC joints brazed using Ag–Cu–In–Ti alloy

doi:10.1007/s40145-014-0095-z

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Abstract

The SiC/SiC joints were vacuum brazed at 700 ℃, 740 ℃, 780 ℃ and 800 ℃ for 10 min respectively, using Ag–Cu–In–Ti active filler alloy. The microstructure and joining strength of the joints were characterized by electron probe X-ray microanalyser (EPMA), energy dispersive spectroscopy (EDS), transmission electron microscopy (TEM) and four-point bending strength test. The interface of the joints was composed of three parts: SiC substrate, reaction layer and filler alloy. A representative microstructure of the reaction layer: In-containing layer/TiC layer/Ti₅Si₃ layer was found from the TEM image. The forming of the In-containing layer could be attributed to the crack or delamination of SiC/TiC interface. The In-containing layer intensified the coefficient of thermal expansion (CTE) mismatch of SiC and the reaction layer, and affected the joining strength. With the increase of the reaction layer's thickness, the joining strength firstly increased, then declined, and the maximum four-point bending strength reached 234 MPa.

Key words： Ag–Cu–In–Ti SiC/SiC joints reaction layer microstructure joining strength

Received: 10 September 2013 Published: 12 June 2015

Corresponding Authors: Yan LIU

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	Yan LIU
	Yunzhou ZHU
	Yong YANG
	Xuejian LIU
	Zhengren HUANG

Cite this article:

Yan LIU,Yunzhou ZHU,Yong YANG, et al. Microstructure of reaction layer and its effect on the joining strength of SiC/SiC joints brazed using Ag–Cu–In–Ti alloy[J]. Journal of Advanced Ceramics, 2014, 3(1): 71-75.

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http://jac.tsinghuajournals.com/EN/10.1007/s40145-014-0095-z OR http://jac.tsinghuajournals.com/EN/Y2014/V3/I1/71

Interfacial microstructure and element map-scanning analysis of SiC/SiC joints.

TEM image of the reaction layer.

Chemical composition of different positions in the reaction layer

Electron diffraction patterns of (a) layer 3 and (b) layer 4.

Effect of the reaction layer's thickness on the joining strength of SiC/SiC joints.

Optical image of fracture path for the SiC/SiC joints.

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